The semiconductor equipment industry is an important part of the overall semiconductor market, with semiconductor chipmakers investing 20% of their sales in obtaining manufacturing equipment. The equipment manufacturing companies are leading the development of most core process technologies in the semiconductor market. The semiconductor production equipment industry is divided into front-end and back-end process equipment. The front-end process includes advanced technology and integration. Investment in front-end equipment is more than back-end equipment, with 60% of the total investment made for front-end equipment. The front-end process is subdivided into front-end-of-the-line (FEOL) and back-end-of-the-line (BEOL).
The analysts forecast global front-end-of-the-line (FEOL) semiconductor equipment market to grow at a CAGR of 1.78% during the period 2016-2020.
Covered in this report
The report covers the present scenario and the growth prospects of the global front-end-of-the-line (FEOL) semiconductor equipment market for 2016-2020. To calculate the market size, the report considers revenue generated from the sales of FEOL semiconductor equipment.
The market is divided into the following segments based on geography:
- Americas
- APAC
- EMEA
Key vendors
- Applied Materials
- ASML
- KLA-Tencor
- Lam Research
- Tokyo Electron
- Dainippon Screen Manufacturing
- Hitachi High-Technologies
- Nikon
- Hitachi Kokusai Electric
- Increase in number of fabs worldwide
- For a full, detailed list, view our report
- High cost of equipment
- For a full, detailed list, view our report
- Proliferation of automotive electronics
- For a full, detailed list, view our report
- What will the market size be in 2020 and what will the growth rate be?
- What are the key market trends?
- What is driving this market?
- What are the challenges to market growth?
- Who are the key vendors in this market space?
- What are the market opportunities and threats faced by the key vendors?
- What are the strengths and weaknesses of the key vendors?
Table of Contents
PART 01: Executive summary
Highlights
PART 02: Scope of the report
Market overview
Definition
Source year and forecast period
Product segmentation
End-user segmentation
Geographical segmentation
Common currency conversion rates
Top-vendor offerings
PART 03: Market research methodology
Research methodology
Economic indicators
PART 04: Introduction
Key market highlights
PART 05: Technology landscape
Technology landscape of wafer fab equipment
Wafer-level manufacturing equipment categories
Key customers
PART 06: Market landscape
Market overview
Market size and forecast
Five forces analysis
PART 07: Market segmentation by product
Market overview
Market size and forecast
PART 08: Market segmentation by end-user
Market overview
Market size and forecast
Foundry
Memory
IDM
PART 09: Geographical segmentation
Global FEOL semiconductor equipment market by geography
Market size and forecast
APAC
Americas
EMEA
PART 10: Key leading countries
Taiwan
South Korea
Japan
PART 11: Market drivers
Increase in number of fabs worldwide
Growth of advanced consumer electronics market
Miniaturization of electronic devices
Advent of 3D ICs
PART 12: Impact of drivers
PART 13: Market challenges
High cost of equipment
Long payback period
Fluctuations in the semiconductor industry
PART 14: Impact of drivers and challenges
PART 15: Market trends
Proliferation of automotive electronics
Growing number of connected devices through IoT and other
emerging markets
Increasing investment in memory capacity
Shorter replacement cycle of smart devices
Adoption of FinFET architecture
PART 16: Vendor landscape
Competitive scenario
Other prominent vendors
List of Exhibits
Exhibit 01: List of major countries considered
Exhibit 02: Product offerings
Exhibit 03: Semiconductor production equipment
Exhibit 04: Semiconductor IC manufacturing process
Exhibit 05: Front-end chip formation steps
Exhibit 06: Back-end chip formation steps
Exhibit 07: Wafer-level manufacturing equipment categories
Exhibit 08: Requirements of a manufacturing equipment
Exhibit 09: Global FEOL semiconductor equipment market
2015-2020 ($ billions)
Exhibit 10: Five forces analysis
Exhibit 11: Global FEOL semiconductor equipment market by
product 2015-2020 (% share)
Exhibit 12: Global FEOL semiconductor equipment market by
product 2015-2020 ($ billions)
Exhibit 13: Global FEOL semiconductor equipment market by
end-user 2015-2020 (% share)
Exhibit 14: Global FEOL semiconductor equipment market by
end-user 2015-2020 ($ billions)
Exhibit 15: Global FEOL semiconductor equipment market by
foundry segment 2015-2020 ($ billions)
Exhibit 16: Global FEOL semiconductor equipment market by
memory segment 2015-2020 ($ billions)
Exhibit 17: Global FEOL semiconductor equipment market by
IDM segment 2015-2020 ($ billions)
Exhibit 18: Global FEOL semiconductor equipment market by
geography 2015-2020 (% share)
Exhibit 19: Global FEOL semiconductor equipment market by
geography 2015-2020 ($ billions)
Exhibit 20: FEOL semiconductor equipment market in APAC
2015-2020 ($ billions)
Exhibit 21: Global wearables market 2015-2020 ($ billions)
Exhibit 22: FEOL semiconductor equipment market in Americas
2015-2020 ($ billions)
Exhibit 23: FEOL semiconductor equipment market in EMEA
2015-2020 ($ billions)
Exhibit 24: Global NAND flash market 2015-2020 (% share)
Exhibit 25: Consumer electronics market 2015-2020 (unit
shipment in millions)
Exhibit 26: Global MEMS market 2015-2020
Exhibit 27: Impact of drivers
Exhibit 28: Global semiconductor market trend 1990-2015 ($
billions)
Exhibit 29: Impact of drivers and challenges
Exhibit 30: Cars shipment growth forecast 2015-2020 (%
growth)
Exhibit 31: IoT spending and device penetration 2014, 2015,
and 2020
Exhibit 32: CAGR of 3D NAND and DRAM 2015-2020
Exhibit 33: Key vendors
Exhibit 34: ASML customers by end-user segment
Exhibit 35: Other prominent vendors
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